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Zeiss Cross-beam 540 Focused Ion Beam/Electron Beam System
Focused Ion Beam and Nanoscale Patterning Suite
The dual beam FIB-SEM system offers a range of capability for 3D heterostructure device fabrication and for TEM sample preparation.
Detailed Description
The dual beam FIB-SEM system offers an alternative to the standard subtractive etch process used in optical lithography. This system can produce smaller devices without breaking vacuum, and without forming ex-situ interfaces. A gas injection nozzle can introduce Water, SiO2, XeF2 Platinum, Carbon and H2O and the instrument is equipped with a Kleindiek lift-out system.
Uses/Applications
Heterostructure device fabrication for a range of magnetic and optical materials systems as well as cross sectional and FIB/SEM tomography analysis of a wide range of materials. For further information see: https://www.wems.msm.cam.ac.uk/electron-microscopy-equipment/zeiss-crossbeam-540.
The dual-beam SEM-FIB system uses Ga ion and electron beam columns to enable direct patterning of micro- and nano-pillar devices.